Semiconductor Testing Chillers – AI And AES Series

Different testing requirements for in Semiconductor Industries:

• Aging test equipment: The matching thermal drying system provides cooling and heating temperature, improves the test efficiency and quality of wafer chips, and has small temperature accuracy error.
• Chip Testing Equipment: The thermal chiller is matched with the test machine, with a temperature control accuracy of ±0.05℃, which improves the chip testing efficiency of the institute.
• Semiconductor Fab: The process chiller is used in semiconductor fabs, with high-precision cooling and heating temperature control, which improves the manufacturing rate of wafers and reduces the scrap rate.

Overview:

• Working Temperature Range: -120degC to +300degC
• FLTZ Multichannel: Has Multichannel Independent Temperature control – it can have separate temperature range, cooling and heating capacity, thermal conductivity medium flow rate, etc. According to the required temperature ranges, steam compression refrigeration or ETCU non compressor heat exchange system can be selected.
• ZLTZ Series: Suitable for temperature control applications such as microchannel reactors, plate heat exchangers, cold plates, heat sink plates and tubular reactors with small heat exchange areas, large refrigeration capacities and small temperature differences. The equipment can automatically recycle the thermal conductive medium.
  The ZLTZ temperature control unit is combined with a microchannel reactor to form a high heat release temperature control application. Under the same flow condition, the heat transfer efficiency of the temperature control is more than 5 times that of the heat transfer oil. At the same time, the temperature difference between the inlet and outlet is small, and the temperature filed uniformity is high, which is particularly suitable for applications with intense heat release reactions. These units are in combination with cold plate and heat sink plate for high heat absorption and high uniformity temperature control.
  The ZLTZ temperature control unit is combined with ESC chucks, vacuum chucks, etc to achieve a temp control range of -65 to 200degC. At the same time, one ZLTZ TCU with multiple ESC chucks can control different temperatures.
• LQ Series: These models use non corrosive gas as a cooling medium such as dry compressed air, nitrogen, argon and other normal temperature gas. The gas can reach the targeted low temperature, supply the demanded test components or heat exchangers.
• AI Series: Suitable models are also used in low and high temperature testing of semiconductor equipment. Electronic equipment high temperature and low temperature thermostat testing cold and heat sources. They can work for continuously long time, automatic defrost and it will also not affect the storage temperature during defrosting. Does no affect the Evaporation process during defrosting.
• AES Series: These Series have jet flow high and low temperature impact tester provides precise and rapid ambient temperature for chips, modules, integrated circuit boards, electronic components, etc. It is an indispensable instrument for electrical performance test, failure analysis and reliability evaluation of products.
• AET Series: In these models the compressed air enters the gas rapid temperature change testing machine, which is equipped with a dryer. The gas is pre dried to a dew point temperature of -70degC or below and then cooled, heated and controlled to output stable flow, pressure and constant temperature gas. The temperature of the target object is controlled (various temp control chucks, chamber environments, heat support plates, material shuttles, chambers, electronic components, etc) and the temperature of the process can be controlled according to the temperature sensor on the remote chuck and then the temperature of the output gas can be automatically adjusted.
• Rapid Temp Change temp control Chuck: This product enables rapid temp changes and precise temp control. The system itself comes with a chiller to avoid the consumption of liquid nitrogen, carbon dioxide, etc. Each system contains a chuck and a cold and heat control unit.
  The system provides an open flat surface working platform, rapid rise and fall, constant temperature control, used in RF devices and high-density power device testing (IGBTs and MOSFETSs), can also be used in laboratory flat plate rapid cooling (Plasma, biological products, batteries), etc.
  The direct refrigerant evaporation method is used inside the plate, which greatly improves the heat transfer efficiency and improves the heat transfer power per unit area of the plate compared with the liquid cooling method.