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Semiconductor Testing Chillers – AI And AES Series

Different testing requirements for in Semiconductor Industries:

  • Aging test equipment: The matching thermal drying system provides cooling and heating temperature, improves the test efficiency and quality of wafer chips, and has small temperature accuracy error.
  • Chip Testing Equipment: The thermal chiller is matched with the test machine, with a temperature control accuracy of ±0.05℃, which improves the chip testing efficiency of the institute.
  • Semiconductor Fab: The process chiller is used in semiconductor fabs, with high-precision cooling and heating temperature control, which improves the manufacturing rate of wafers and reduces the scrap rate.

Overview:

  • Working Temperature Range: -120degC to +300degC
  • FLTZ Multichannel: Has Multichannel Independent Temperature control – it can have separate temperature range, cooling and heating capacity, thermal conductivity medium flow rate, etc. According to the required temperature ranges, steam compression refrigeration or ETCU non compressor heat exchange system can be selected.
  • ZLTZ Series: Suitable for temperature control applications such as microchannel reactors, plate heat exchangers, cold plates, heat sink plates and tubular reactors with small heat exchange areas, large refrigeration capacities and small temperature differences. The equipment can automatically recycle the thermal conductive medium.
    The ZLTZ temperature control unit is combined with a microchannel reactor to form a high heat release temperature control application. Under the same flow condition, the heat transfer efficiency of the temperature control is more than 5 times that of the heat transfer oil. At the same time, the temperature difference between the inlet and outlet is small, and the temperature filed uniformity is high, which is particularly suitable for applications with intense heat release reactions. These units are in combination with cold plate and heat sink plate for high heat absorption and high uniformity temperature control.
    The ZLTZ temperature control unit is combined with ESC chucks, vacuum chucks, etc to achieve a temp control range of -65 to 200degC. At the same time, one ZLTZ TCU with multiple ESC chucks can control different temperatures.
  • LQ Series: These models use non corrosive gas as a cooling medium such as dry compressed air, nitrogen, argon and other normal temperature gas. The gas can reach the targeted low temperature, supply the demanded test components or heat exchangers.
  • AI Series: Suitable models are also used in low and high temperature testing of semiconductor equipment. Electronic equipment high temperature and low temperature thermostat testing cold and heat sources. They can work for continuously long time, automatic defrost and it will also not affect the storage temperature during defrosting. Does no affect the Evaporation process during defrosting.
  • AES Series: These Series have jet flow high and low temperature impact tester provides precise and rapid ambient temperature for chips, modules, integrated circuit boards, electronic components, etc. It is an indispensable instrument for electrical performance test, failure analysis and reliability evaluation of products.
  • AET Series: In these models the compressed air enters the gas rapid temperature change testing machine, which is equipped with a dryer. The gas is pre dried to a dew point temperature of -70degC or below and then cooled, heated and controlled to output stable flow, pressure and constant temperature gas. The temperature of the target object is controlled (various temp control chucks, chamber environments, heat support plates, material shuttles, chambers, electronic components, etc) and the temperature of the process can be controlled according to the temperature sensor on the remote chuck and then the temperature of the output gas can be automatically adjusted.
  • Rapid Temp Change temp control Chuck: This product enables rapid temp changes and precise temp control. The system itself comes with a chiller to avoid the consumption of liquid nitrogen, carbon dioxide, etc. Each system contains a chuck and a cold and heat control unit.
    The system provides an open flat surface working platform, rapid rise and fall, constant temperature control, used in RF devices and high-density power device testing (IGBTs and MOSFETSs), can also be used in laboratory flat plate rapid cooling (Plasma, biological products, batteries), etc.
    The direct refrigerant evaporation method is used inside the plate, which greatly improves the heat transfer efficiency and improves the heat transfer power per unit area of the plate compared with the liquid cooling method.
AI Series
Model AI-6535 / AI-6535W AI-8035W AI-1055W
Temperature Range -65°C to +125°C -80°C to +125°C -105°C to +125°C
Control Mode PID Adaptive Controller
Communication Protocol MODBUS RTU Protocol, RS 485 interface
Temp Feedback PT100
Operation Panel 7 inch colour touch screen, show temp. curve / EXCEL data output
Temp Accuracy ±0.05°C (steady state outlet temperature)
Heating Power 3.5kW 3.5kW 3.5kW
Cooling Capacity 125°C 3.5kW 3.5kW 3.5kW
0°C 3.5kW 3.5kW 3.5kW
-20°C 3kW 3.5kW 3.5kW
-40°C 2.1kW 2.5kW 3.5kW
-60°C 1kW 2.1kW 3kW
-75°C 1kW 2kW
-95°C 1kW
Ciculating airflow 550m³/h 550m³/h 550m³/h
Inlet and outlet air interface DN125 DN125 DN125
Compressor Emerson Copeland Scroll Flexible Compressor
Safety Protection Self-diagnosis function; Phase sequence protection; Freezer overload protection; high pressure switch; overload relay; thermal protection device
Defrosting Device There are installed defrosting device and condensate drain inside
Continuous running Running continuously
Timing Operation Can set timed start and stop time
Refrigerant R404A R23 R404A R508B R404A R23 R14
Water Cooled 1200 L/H 1.5bar-4bar 1600 L/H 1.5bar-4bar 2600 L/H 1.5bar-4bar
Dimension (cm) 55*100*175 55*100*175 70*100*175
Weight 280Kg 300Kg 360Kg
Shell Material Cold rolled sheet spray coating REL 7035
AES Series
Model AES-4535
AES-4535W		 AES-6035
AES-6035W		 AES-8035
AES-8035W		 AES-A1035W AES-A1235W
Temp Range -40°C to +225°C -60°C to +225°C -80°C to +225°C -100°C to +225°C -120°C to +225°C
Temp Control accuracy ±0.1°C (Steady State Outlet Temperature)
Air requirements Air Filter < 5um air oil content < 0.1um air temp and humidity : 5°C-32°C 0-50%RH
Air treatment capacity 10m³/h-30m³/h Pressure 5bar-7.6bar
Throttling method Electronic Expansion Valve
Controller PLC Controller
Display and record The pressure of the refrigeration system is realized by a pointer pressure gauge, and the pressure of the circulation system is detected by a presssure sensor and displayed on the touch screen
Main components Danfoss drying filter, casto solenoid valve, Danfoss pressure controller, EBM fan (air-cooled), Danfoss/Emerson oil seperator, SMC filter, Emerson eletronic expansion valve, Johnson pressure sensor
Compressor Tecumseh, Dorin
High temperature cooling Possess high-temperature 225°C direct cooling technology to meet the target and quickly cool down during high-temperature operation
Process control The remote target temperature can be controlled by combining the self created model free self built free algorithm and cascade algorithm
Dimensions (cm) 54*69*132 54*69*132 54*69*132 80*120*175 100*150*185

Semiconductor Testing Chillers – AET And MD Series

Different testing requirements for in Semiconductor Industries:

  • Aging test equipment: The matching thermal drying system provides cooling and heating temperature, improves the test efficiency and quality of wafer chips, and has small temperature accuracy error.
  • Chip Testing Equipment: The thermal chiller is matched with the test machine, with a temperature control accuracy of ±0.05℃, which improves the chip testing efficiency of the institute.
  • Semiconductor Fab: The process chiller is used in semiconductor fabs, with high-precision cooling and heating temperature control, which improves the manufacturing rate of wafers and reduces the scrap rate.

Overview:

  • Working Temperature Range: -120degC to +300degC
  • FLTZ Multichannel: Has Multichannel Independent Temperature control – it can have separate temperature range, cooling and heating capacity, thermal conductivity medium flow rate, etc. According to the required temperature ranges, steam compression refrigeration or ETCU non compressor heat exchange system can be selected.
  • ZLTZ Series: Suitable for temperature control applications such as microchannel reactors, plate heat exchangers, cold plates, heat sink plates and tubular reactors with small heat exchange areas, large refrigeration capacities and small temperature differences. The equipment can automatically recycle the thermal conductive medium.
    The ZLTZ temperature control unit is combined with a microchannel reactor to form a high heat release temperature control application. Under the same flow condition, the heat transfer efficiency of the temperature control is more than 5 times that of the heat transfer oil. At the same time, the temperature difference between the inlet and outlet is small, and the temperature filed uniformity is high, which is particularly suitable for applications with intense heat release reactions. These units are in combination with cold plate and heat sink plate for high heat absorption and high uniformity temperature control.
    The ZLTZ temperature control unit is combined with ESC chucks, vacuum chucks, etc to achieve a temp control range of -65 to 200degC. At the same time, one ZLTZ TCU with multiple ESC chucks can control different temperatures.
  • LQ Series: These models use non corrosive gas as a cooling medium such as dry compressed air, nitrogen, argon and other normal temperature gas. The gas can reach the targeted low temperature, supply the demanded test components or heat exchangers.
  • AI Series: Suitable models are also used in low and high temperature testing of semiconductor equipment. Electronic equipment high temperature and low temperature thermostat testing cold and heat sources. They can work for continuously long time, automatic defrost and it will also not affect the storage temperature during defrosting. Does no affect the Evaporation process during defrosting.
  • AES Series: These Series have jet flow high and low temperature impact tester provides precise and rapid ambient temperature for chips, modules, integrated circuit boards, electronic components, etc. It is an indispensable instrument for electrical performance test, failure analysis and reliability evaluation of products.
  • AET Series: In these models the compressed air enters the gas rapid temperature change testing machine, which is equipped with a dryer. The gas is pre dried to a dew point temperature of -70degC or below and then cooled, heated and controlled to output stable flow, pressure and constant temperature gas. The temperature of the target object is controlled (various temp control chucks, chamber environments, heat support plates, material shuttles, chambers, electronic components, etc) and the temperature of the process can be controlled according to the temperature sensor on the remote chuck and then the temperature of the output gas can be automatically adjusted.
  • Rapid Temp Change temp control Chuck: This product enables rapid temp changes and precise temp control. The system itself comes with a chiller to avoid the consumption of liquid nitrogen, carbon dioxide, etc. Each system contains a chuck and a cold and heat control unit.
    The system provides an open flat surface working platform, rapid rise and fall, constant temperature control, used in RF devices and high-density power device testing (IGBTs and MOSFETSs), can also be used in laboratory flat plate rapid cooling (Plasma, biological products, batteries), etc.
    The direct refrigerant evaporation method is used inside the plate, which greatly improves the heat transfer efficiency and improves the heat transfer power per unit area of the plate compared with the liquid cooling method.
AET Series
Model AET-4025
AET-4025C		 AET-4050
AET-4050C		 AET-4095W
AET-4095WC		 AET-7025
AET-7025C		 AET-7050W
AET-7050WC		 AET-7095
AET-7095WC
Temp Range -40°C to +250°C -40°C to +250°C -40°C to +250°C -75°C to +250°C -75°C to +250°C -75°C to +250°C
Temp accuracy Gas outlet temperature ±0.1°C, remote process temperature precision ±0.5°C
Optional gas temperature for mouth making and process target temperature
Upgrade temp rate The temperature rise and fall rate of the gas outlet of the equipment is greater than 30°C/min, and gradient temperature rise and fall can be performed
Air treatment capacity 10m³/h-30m³/h Pressure 5bar-7.6bar
Air requirements Air Filter < 5um, air oil content < 0.1um, air temp and humidity : 5°C-32°C, 0-50%RH, pressure 4bar-8bar
Air handling 22m³/h 50m³/h 95m³/h 22m³/h 50m³/h 95m³/h
Throttling method Refrigeration system adopts electronic expansion valve throttling to precisely control the cooling capacity
Controller PLC programmable controller, standard support for ModbusRTU protocol, RS485 interface, optional other communication protocols
Display Records 7inch color touch screen, display gas temperature, pressure, flow rate, refrigeration system pressure and temperature
Process temperature control The remote target temperature can be controlled by combining the self created model free self built free algorithm and cascade algorithm
Remarks The suffix W represents water cooling
The suffix C represents gas recycling
Dimensions (cm) 43*46*112 52*57*132 60*63*160 54*69*112 65*85*132 75*95*160
MD Series
Model MD-708 MD-712 MDL-708
Temp Range -75°C to 225°C
Temp accuracy ±0.5°C (steady state outlet temperature)
Plate temp. uniformity ±1°C
Flatness of the plate ±15um
Plate Size 200mm diameter disc 300mm diameter disc 150mm*200mm
Host and card connection cable 2.5m (other lengths can be customized)
Flat surface treatment Nickel Plating (optional gold plating)
Heating -60°C to +25°C: 2 min , 0°C to +25°C: 2 min , +25°C to +220°C: 6 min
Cooling 220°C to +25°C: 2 min , +25°C to -60°C: 6 min
Control system PLC controller, heating feedforward PID fuzzy algorithm, cooling electronic expansion valve PID regulation control cooling capacity
Display and record 7 inch color touch screen, record curve temperature and alarm
Communication Ethernet interface, TC/IP protocol
Compressor Tecumseh
Equipment dimension (cm) 55*65*37 55*65*37 55*65*37

Semiconductor Testing Chillers – LQ Series: Gas Cooling

Different testing requirements for in Semiconductor Industries:

  • Aging test equipment: The matching thermal drying system provides cooling and heating temperature, improves the test efficiency and quality of wafer chips, and has small temperature accuracy error.
  • Chip Testing Equipment: The thermal chiller is matched with the test machine, with a temperature control accuracy of ±0.05℃, which improves the chip testing efficiency of the institute.
  • Semiconductor Fab: The process chiller is used in semiconductor fabs, with high-precision cooling and heating temperature control, which improves the manufacturing rate of wafers and reduces the scrap rate.

Overview:

  • Working Temperature Range: -120degC to +300degC
  • FLTZ Multichannel: Has Multichannel Independent Temperature control – it can have separate temperature range, cooling and heating capacity, thermal conductivity medium flow rate, etc. According to the required temperature ranges, steam compression refrigeration or ETCU non compressor heat exchange system can be selected.
  • ZLTZ Series: Suitable for temperature control applications such as microchannel reactors, plate heat exchangers, cold plates, heat sink plates and tubular reactors with small heat exchange areas, large refrigeration capacities and small temperature differences. The equipment can automatically recycle the thermal conductive medium.
    The ZLTZ temperature control unit is combined with a microchannel reactor to form a high heat release temperature control application. Under the same flow condition, the heat transfer efficiency of the temperature control is more than 5 times that of the heat transfer oil. At the same time, the temperature difference between the inlet and outlet is small, and the temperature filed uniformity is high, which is particularly suitable for applications with intense heat release reactions. These units are in combination with cold plate and heat sink plate for high heat absorption and high uniformity temperature control.
    The ZLTZ temperature control unit is combined with ESC chucks, vacuum chucks, etc to achieve a temp control range of -65 to 200degC. At the same time, one ZLTZ TCU with multiple ESC chucks can control different temperatures.
  • LQ Series: These models use non corrosive gas as a cooling medium such as dry compressed air, nitrogen, argon and other normal temperature gas. The gas can reach the targeted low temperature, supply the demanded test components or heat exchangers.
  • AI Series: Suitable models are also used in low and high temperature testing of semiconductor equipment. Electronic equipment high temperature and low temperature thermostat testing cold and heat sources. They can work for continuously long time, automatic defrost and it will also not affect the storage temperature during defrosting. Does no affect the Evaporation process during defrosting.
  • AES Series: These Series have jet flow high and low temperature impact tester provides precise and rapid ambient temperature for chips, modules, integrated circuit boards, electronic components, etc. It is an indispensable instrument for electrical performance test, failure analysis and reliability evaluation of products.
  • AET Series: In these models the compressed air enters the gas rapid temperature change testing machine, which is equipped with a dryer. The gas is pre dried to a dew point temperature of -70degC or below and then cooled, heated and controlled to output stable flow, pressure and constant temperature gas. The temperature of the target object is controlled (various temp control chucks, chamber environments, heat support plates, material shuttles, chambers, electronic components, etc) and the temperature of the process can be controlled according to the temperature sensor on the remote chuck and then the temperature of the output gas can be automatically adjusted.
  • Rapid Temp Change temp control Chuck: This product enables rapid temp changes and precise temp control. The system itself comes with a chiller to avoid the consumption of liquid nitrogen, carbon dioxide, etc. Each system contains a chuck and a cold and heat control unit.
    The system provides an open flat surface working platform, rapid rise and fall, constant temperature control, used in RF devices and high-density power device testing (IGBTs and MOSFETSs), can also be used in laboratory flat plate rapid cooling (Plasma, biological products, batteries), etc.
    The direct refrigerant evaporation method is used inside the plate, which greatly improves the heat transfer efficiency and improves the heat transfer power per unit area of the plate compared with the liquid cooling method.
LQ Series: Gas Cooling
Model LQ-4015
LQ-4015W		 LQ-4030
LQ-4030W		 LQ-4060
LQ-4060W		 LQ-40100
LQ-40100W		 LQ-7515
LQ-7515W		 LQ-7530
LQ-7530W		 LQ-7560
LQ-7560W		 LQ-75100
LQ-75100W
Gas Flow 15m³/h 30m³/h 60m³/h 100m³/h 15m³/h 30m³/h 60m³/h 100m³/h
Lowest Temperature -40°C -40°C -40°C -40°C -75°C -75°C -75°C -75°C
Air Inlet and outlet size ZG3/8 ZG3/8 ZG1/2 DN50 ZG3/8 ZG3/8 ZG1/2 DN50
Control System Programmable controller and module
Display and Record 7 inch colour touch screen, record curve temperature and alarm
Compressor Tecumseh, Emerson Copeland
Process temperature control The remote target temperature can be controlled by combining the self created model free self built free algorithm and cascade algorithm
Dimension (cm) 54*67*135 55*75*155 65*85*175 75*95*185 54*67*135 55*75*155 65*85*175 75*95*175
Circuit Breaker 10A 10A 10A 16A 10A 16A 16A 25A
LQ Series: Gas Cooling
Model LQ-A1015W LQ-A1030W LQ-A1060W LQ-A10100W
Gas Flow 15m³/h 30m³/h 60m³/h 100m³/h
Lowest Temperature -110°C -110°C -110°C -110°C
Heat Exchanger Material SUS304 contains small amount of copper
Air Inlet and Outlet Size ZG3/8 ZG1/2 ZG1 DN50
Control System Programmable controller and module
Display and Record 7 inch colour touch screen, record curve temperature and alarm
Compressor Tecumseh, Emerson Copeland
Process Temperature Control The remote target temperature can be controlled by combining the self created model free self built free algorithm and cascade algorithm
Dimension (cm) 75*95*175 80*120*175 100*125*185 115*150*195

Semiconductor Testing Chillers – ZLTZ Series

Different testing requirements for in Semiconductor Industries:

  • Aging test equipment: The matching thermal drying system provides cooling and heating temperature, improves the test efficiency and quality of wafer chips, and has small temperature accuracy error.
  • Chip Testing Equipment: The thermal chiller is matched with the test machine, with a temperature control accuracy of ±0.05℃, which improves the chip testing efficiency of the institute.
  • Semiconductor Fab: The process chiller is used in semiconductor fabs, with high-precision cooling and heating temperature control, which improves the manufacturing rate of wafers and reduces the scrap rate.

Overview:

  • Working Temperature Range: -120degC to +300degC
  • FLTZ Multichannel: Has Multichannel Independent Temperature control – it can have separate temperature range, cooling and heating capacity, thermal conductivity medium flow rate, etc. According to the required temperature ranges, steam compression refrigeration or ETCU non compressor heat exchange system can be selected.
  • ZLTZ Series: Suitable for temperature control applications such as microchannel reactors, plate heat exchangers, cold plates, heat sink plates and tubular reactors with small heat exchange areas, large refrigeration capacities and small temperature differences. The equipment can automatically recycle the thermal conductive medium.
    The ZLTZ temperature control unit is combined with a microchannel reactor to form a high heat release temperature control application. Under the same flow condition, the heat transfer efficiency of the temperature control is more than 5 times that of the heat transfer oil. At the same time, the temperature difference between the inlet and outlet is small, and the temperature filed uniformity is high, which is particularly suitable for applications with intense heat release reactions. These units are in combination with cold plate and heat sink plate for high heat absorption and high uniformity temperature control.
    The ZLTZ temperature control unit is combined with ESC chucks, vacuum chucks, etc to achieve a temp control range of -65 to 200degC. At the same time, one ZLTZ TCU with multiple ESC chucks can control different temperatures.
  • LQ Series: These models use non corrosive gas as a cooling medium such as dry compressed air, nitrogen, argon and other normal temperature gas. The gas can reach the targeted low temperature, supply the demanded test components or heat exchangers.
  • AI Series: Suitable models are also used in low and high temperature testing of semiconductor equipment. Electronic equipment high temperature and low temperature thermostat testing cold and heat sources. They can work for continuously long time, automatic defrost and it will also not affect the storage temperature during defrosting. Does no affect the Evaporation process during defrosting.
  • AES Series: These Series have jet flow high and low temperature impact tester provides precise and rapid ambient temperature for chips, modules, integrated circuit boards, electronic components, etc. It is an indispensable instrument for electrical performance test, failure analysis and reliability evaluation of products.
  • AET Series: In these models the compressed air enters the gas rapid temperature change testing machine, which is equipped with a dryer. The gas is pre dried to a dew point temperature of -70degC or below and then cooled, heated and controlled to output stable flow, pressure and constant temperature gas. The temperature of the target object is controlled (various temp control chucks, chamber environments, heat support plates, material shuttles, chambers, electronic components, etc) and the temperature of the process can be controlled according to the temperature sensor on the remote chuck and then the temperature of the output gas can be automatically adjusted.
  • Rapid Temp Change temp control Chuck: This product enables rapid temp changes and precise temp control. The system itself comes with a chiller to avoid the consumption of liquid nitrogen, carbon dioxide, etc. Each system contains a chuck and a cold and heat control unit.
    The system provides an open flat surface working platform, rapid rise and fall, constant temperature control, used in RF devices and high-density power device testing (IGBTs and MOSFETSs), can also be used in laboratory flat plate rapid cooling (Plasma, biological products, batteries), etc.
    The direct refrigerant evaporation method is used inside the plate, which greatly improves the heat transfer efficiency and improves the heat transfer power per unit area of the plate compared with the liquid cooling method.
ZLTZ SERIES
Model ZLTZ-3 / ZLTZ-3W ZLTZ-6 / ZLTZ-6W ZLTZ-10 / ZLTZ-10W
Temp Range -10°C to +25°C -10°C to +25°C -10°C to +25°C
Temp Control ±0.3°C ±0.3°C ±0.3°C
Temp Control Accuracy Pt100 Pt100 Pt100
Cooling capacity at 0°C 5kW 10kW 16kW
Compressor Inverter Compressor
Throttling method Electronic Expansion Valve
Operation Panel 7-inch colour touch screen / PLC controller
Communication Modbus RTU protocol RS485 interface, Ethernet TCP/IP protocol
Refrigerant R134A
Interface Size G1/2 G1/2 G1/2
Water cooled at 20°C 1500L/H
G1/2		 3000L/H
G3/4		 4500L/H
G3/4
Water cooled condenser The water-cooled equipment condenser uses plate heat exchangers and requires water supply from a chiller or a closed cooling tower
Air Cooled Condenser Microchannel Heat Exchanger Microchannel Heat Exchanger Microchannel Heat Exchanger
Power 380V 50Hz, can choose three-phase 220V / 460V
Pipe Materials Copper, SUS 304
Shell material Cold rolled sheet (standard color 7035)
ZLTZ SERIES
Model ZLTZ3-3
ZLTZ-3-3W		 ZLTZ3-6
ZLTZ3-6W		 ZLTZ3-10
ZLTZ3-10W
Temp Range -30°C to +25°C -30°C to +25°C -30°C to +25°C
Temp Control ±0.3°C ±0.3°C ±0.3°C
Temp Control Accuracy Pt100 Pt100 Pt100
Cooling capacity at -20°C 3kW 6.5kW 11kW
Compressor Inverter Compressor
Throttling method Electronic Expansion Valve
Operation Panel 7-inch colour touch screen / PLC controller
Communication Modbus RTU protocol RS485 interface, Ethernet TCP/IP protocol
Refrigerant R507C / R448A
Interface Size G1/2 G1/2 G3/4
Water cooled at 20°C 1500L/H
G1/2		 3000L/H
G3/4		 4500L/H
G3/4
Water cooled condenser The water-cooled equipment condenser uses plate heat exchangers and requires water supply from a chiller or a closed cooling tower
Air Cooled Condenser Microchannel Heat Exchanger Microchannel Heat Exchanger Microchannel Heat Exchanger
Power 380V 50Hz, can choose three-phase 220V / 460V
Pipe Materials Copper, SUS 304
Shell material Cold rolled sheet (standard color 7035)
ZLTZ SERIES
Model ZLTZ6-3 / ZLTZ6-3W ZLTZ6-6 / ZLTZ6-6W ZLTZ6-10 / ZLTZ6-10W
Temp Range -65°C to -30°C -65°C to -30°C -65°C to -30°C
Temp Control ±0.3°C ±0.3°C ±0.3°C
Temp Control Accuracy Pt100 Pt100 Pt100
Cooling capacity at -50°C 2.6kW 5kW 8kW
Compressor Inverter Compressor
Throttling method Electronic Expansion Valve
Operation Panel 7-inch colour touch screen / PLC controller
Communication Modbus RTU protocol RS485 interface, Ethernet TCP/IP protocol
Refrigerant R448A
Interface Size G1/2 G1/2 G1/2
Water cooled at 20°C 2000L/H
G1/2		 4000L/H
G3/4		 6000L/H
G3/4
Water cooled condenser The water-cooled equipment condenser uses plate heat exchangers and requires water supply from a chiller or a closed cooling tower
Air Cooled Condenser Microchannel Heat Exchanger Microchannel Heat Exchanger Microchannel Heat Exchanger
Power 380V 50Hz, can choose three-phase 220V/460V
Pipe Materials Copper, SUS 304
Shell material Cold rolled sheet (standard color 7035)

Semiconductor Testing Chillers – FLTZ Multi Channel

Different testing requirements for in Semiconductor Industries:

  • Aging test equipment: The matching thermal drying system provides cooling and heating temperature, improves the test efficiency and quality of wafer chips, and has small temperature accuracy error.
  • Chip Testing Equipment: The thermal chiller is matched with the test machine, with a temperature control accuracy of ±0.05℃, which improves the chip testing efficiency of the institute.
  • Semiconductor Fab: The process chiller is used in semiconductor fabs, with high-precision cooling and heating temperature control, which improves the manufacturing rate of wafers and reduces the scrap rate.

Overview:

  • Working Temperature Range: -120degC to +300degC
  • FLTZ Multichannel: Has Multichannel Independent Temperature control – it can have separate temperature range, cooling and heating capacity, thermal conductivity medium flow rate, etc. According to the required temperature ranges, steam compression refrigeration or ETCU non compressor heat exchange system can be selected.
  • ZLTZ Series: Suitable for temperature control applications such as microchannel reactors, plate heat exchangers, cold plates, heat sink plates and tubular reactors with small heat exchange areas, large refrigeration capacities and small temperature differences. The equipment can automatically recycle the thermal conductive medium.
    The ZLTZ temperature control unit is combined with a microchannel reactor to form a high heat release temperature control application. Under the same flow condition, the heat transfer efficiency of the temperature control is more than 5 times that of the heat transfer oil. At the same time, the temperature difference between the inlet and outlet is small, and the temperature filed uniformity is high, which is particularly suitable for applications with intense heat release reactions. These units are in combination with cold plate and heat sink plate for high heat absorption and high uniformity temperature control.
    The ZLTZ temperature control unit is combined with ESC chucks, vacuum chucks, etc to achieve a temp control range of -65 to 200degC. At the same time, one ZLTZ TCU with multiple ESC chucks can control different temperatures.
  • LQ Series: These models use non corrosive gas as a cooling medium such as dry compressed air, nitrogen, argon and other normal temperature gas. The gas can reach the targeted low temperature, supply the demanded test components or heat exchangers.
  • AI Series: Suitable models are also used in low and high temperature testing of semiconductor equipment. Electronic equipment high temperature and low temperature thermostat testing cold and heat sources. They can work for continuously long time, automatic defrost and it will also not affect the storage temperature during defrosting. Does no affect the Evaporation process during defrosting.
  • AES Series: These Series have jet flow high and low temperature impact tester provides precise and rapid ambient temperature for chips, modules, integrated circuit boards, electronic components, etc. It is an indispensable instrument for electrical performance test, failure analysis and reliability evaluation of products.
  • AET Series: In these models the compressed air enters the gas rapid temperature change testing machine, which is equipped with a dryer. The gas is pre dried to a dew point temperature of -70degC or below and then cooled, heated and controlled to output stable flow, pressure and constant temperature gas. The temperature of the target object is controlled (various temp control chucks, chamber environments, heat support plates, material shuttles, chambers, electronic components, etc) and the temperature of the process can be controlled according to the temperature sensor on the remote chuck and then the temperature of the output gas can be automatically adjusted.
  • Rapid Temp Change temp control Chuck: This product enables rapid temp changes and precise temp control. The system itself comes with a chiller to avoid the consumption of liquid nitrogen, carbon dioxide, etc. Each system contains a chuck and a cold and heat control unit.
    The system provides an open flat surface working platform, rapid rise and fall, constant temperature control, used in RF devices and high-density power device testing (IGBTs and MOSFETSs), can also be used in laboratory flat plate rapid cooling (Plasma, biological products, batteries), etc.
    The direct refrigerant evaporation method is used inside the plate, which greatly improves the heat transfer efficiency and improves the heat transfer power per unit area of the plate compared with the liquid cooling method.
FLTZ Multi Channel
Model FLTZ-203W-2T
Pipeline Channel 1 Channel 2
Temp Range -20°C to +90°C -20°C to +90°C
Temp Control accuracy ±0.1°C ±0.1°C
Cooling capacity 4kW @ -10°C 4kW @ -10°C
Heating capacity 2kW 2kW
Heat conducting medium flow rate 20L/min @ 0.5MPa 20L/min @ 0.5MPa
Heat conducting medium connection size ZG3/4 ZG3/4
Ambient Temperature 10 – 35 °C 10 – 35 °C
Ambient humidity 30 – 70% 30 – 70%
Cooling water temperature 15 – 20 °C 15 – 20 °C
Cooling water flow rate 20L/min 20L/min
Weight 400Kg
Circuit Breaker 30A
Process temperature Control The remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm
Dimension cm 50*90*160
FLTZ Multi Channel
Model FLTZ-203W-2T
Pipeline Channel 1 Channel 2
Temp Range -45°C to +40°C +10°C to +80°C
Temp Control accuracy ±0.1°C ±0.1°C
Cooling capacity 11kW @ -20°C 5kW @ -40°C 13kW @ +10°C
Heating capacity 2kW 6kW
Heat conducting medium flow rate 17L/min @ 0.7MPa 17L/min @ 0.7MPa
Heat conducting medium connection size ZG3/4 ZG3/4
Ambient Temperature 10 – 35 °C 10 – 35 °C
Ambient humidity 30 – 70% 30 – 70%
Cooling water temperature 15 – 20 °C 15 – 20 °C
Cooling water flow rate 40L/min 20L/min
Weight 400Kg
Circuit Breaker 80A
Process temperature Control The remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm
Dimension cm 60*100*185
FLTZ Multi Channel
Model FLTZ-203W/ETCU-008W
Pipeline Channel 1 Channel 2 Channel 3
Temp Range -10°C to +60°C +30°C to +80°C -10°C to +80°C
Temp Control accuracy ±0.1°C ±0.1°C ±0.1°C
Cooling capacity 4kW @ -10°C
21kW @ +20°C		 6kW @ +30°C 3kW @ -10°C
Heating capacity 4kW 4.5+6kW 3kW
Heat conducting medium flow rate 17L/min @ 0.7MPa 17L/min @ 0.7MPa 17L/min @ 0.7MPa
Heat conducting medium connection size ZG3/4 ZG3/4 ZG3/5
Ambient Temperature 10 – 35 °C 10 – 35 °C 10 – 35 °C
Ambient humidity 30 – 70% 30 – 70% 31 – 70%
Cooling water temperature 15 – 20 °C 15 – 20 °C 15 – 20 °C
Cooling water flow rate 30L/min @ 15-20 °C 15L/min @ 15-20 °C 15L/min @ 15-20 °C
Weight 600Kg
Circuit Breaker 100A
Process temperature Control The remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm
Dimension cm 60*100*170
FLTZ Multi Channel
Model FLTZ-215W/ETCU-015W/ETCU-008W
Pipeline Channel 1 Channel 2 Channel 3
Temp Range -20°C to +50°C +30°C to +100°C +30°C to +40°C
Temp Control accuracy ±0.1°C ±0.1°C ±0.1°C
Cooling capacity 15kW @ -10°C 13kW @ PCW +15°C 8kW @ PCW +10°C
Heating capacity 2kW 6kW Pump Heat Loss
Heat conducting medium flow rate 30L/min @ 0.85MPa 30L/min @ 0.85MPa 20L/min @ 0.8MPa
Heat conducting medium connection size ZG3/4 ZG3/4 ZG3/5
Ambient Temperature 10 – 35 °C 10 – 35 °C 10 – 35 °C
Ambient humidity 30 – 70% 30 – 70% 31 – 70%
Cooling water temperature 15 – 20 °C 15 – 20 °C 15 – 20 °C
Cooling water flow rate 30L/min @ 15-20 °C 15L/min @ 15-20 °C 15L/min @ 15-20 °C
Weight 600Kg
Circuit Breaker 75A
Process temperature Control The remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm
Dimension cm 60*100*170
FLTZ Multichannel
Model FLTZ-203W/2T dual system FLTZ-305W/2T dual system FLTZ-406W/2T dual system
Temp Range -20°C to +90°C -30°C to +90°C -45°C to +90°C
Temp Control accuracy ±0.1°C
Heat conducting medium flow rate 15 – 45L/min; 6 bar max
Cooling capacity 3kW @ -15°C 3kW @ -15°C 5kW @ -15°C 5kW @ -15°C 2.5kW @ -35°C 2.5kW @ -35°C
Heating capacity 2.5kW 2.5kW 2.5kW 2.5kW 3.5kW 3.5kW
Internal circulation fluid volume 5L 5L 8L 8L 8L 8L
Expansion Tank Volume 15L 15L 25L 25L 25L 25L
Heat Conducting medium Fluorinated liquid, antifreeze, thermal conductive silicone oil, etc
Refrigerant R448
Heat Conducting Medium Interface ZG3/4
Cooling water interface ZG3/4
Cooling water 50L/min at 20°C 60L/min at 20°C 50L/min at 20°C
Power Three phase 220V / Three phase 400V / Three phase 460V
Process Temperature Control The remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm

Semiconductor Testing Chillers – Low Temperature Cascade Series

Different testing requirements for in Semiconductor Industries:

  • Aging test equipment: The matching thermal drying system provides cooling and heating temperature, improves the test efficiency and quality of wafer chips, and has small temperature accuracy error.
  • Chip Testing Equipment: The thermal chiller is matched with the test machine, with a temperature control accuracy of ±0.05℃, which improves the chip testing efficiency of the institute.
  • Semiconductor Fab: The process chiller is used in semiconductor fabs, with high-precision cooling and heating temperature control, which improves the manufacturing rate of wafers and reduces the scrap rate.

Overview:

  • Working Temperature Range: -120degC to +300degC
  • FLTZ Multichannel: Has Multichannel Independent Temperature control – it can have separate temperature range, cooling and heating capacity, thermal conductivity medium flow rate, etc. According to the required temperature ranges, steam compression refrigeration or ETCU non compressor heat exchange system can be selected.
  • ZLTZ Series: Suitable for temperature control applications such as microchannel reactors, plate heat exchangers, cold plates, heat sink plates and tubular reactors with small heat exchange areas, large refrigeration capacities and small temperature differences. The equipment can automatically recycle the thermal conductive medium.
    The ZLTZ temperature control unit is combined with a microchannel reactor to form a high heat release temperature control application. Under the same flow condition, the heat transfer efficiency of the temperature control is more than 5 times that of the heat transfer oil. At the same time, the temperature difference between the inlet and outlet is small, and the temperature filed uniformity is high, which is particularly suitable for applications with intense heat release reactions. These units are in combination with cold plate and heat sink plate for high heat absorption and high uniformity temperature control.
    The ZLTZ temperature control unit is combined with ESC chucks, vacuum chucks, etc to achieve a temp control range of -65 to 200degC. At the same time, one ZLTZ TCU with multiple ESC chucks can control different temperatures.
  • LQ Series: These models use non corrosive gas as a cooling medium such as dry compressed air, nitrogen, argon and other normal temperature gas. The gas can reach the targeted low temperature, supply the demanded test components or heat exchangers.
  • AI Series: Suitable models are also used in low and high temperature testing of semiconductor equipment. Electronic equipment high temperature and low temperature thermostat testing cold and heat sources. They can work for continuously long time, automatic defrost and it will also not affect the storage temperature during defrosting. Does no affect the Evaporation process during defrosting.
  • AES Series: These Series have jet flow high and low temperature impact tester provides precise and rapid ambient temperature for chips, modules, integrated circuit boards, electronic components, etc. It is an indispensable instrument for electrical performance test, failure analysis and reliability evaluation of products.
  • AET Series: In these models the compressed air enters the gas rapid temperature change testing machine, which is equipped with a dryer. The gas is pre dried to a dew point temperature of -70degC or below and then cooled, heated and controlled to output stable flow, pressure and constant temperature gas. The temperature of the target object is controlled (various temp control chucks, chamber environments, heat support plates, material shuttles, chambers, electronic components, etc) and the temperature of the process can be controlled according to the temperature sensor on the remote chuck and then the temperature of the output gas can be automatically adjusted.
  • Rapid Temp Change temp control Chuck: This product enables rapid temp changes and precise temp control. The system itself comes with a chiller to avoid the consumption of liquid nitrogen, carbon dioxide, etc. Each system contains a chuck and a cold and heat control unit.
    The system provides an open flat surface working platform, rapid rise and fall, constant temperature control, used in RF devices and high-density power device testing (IGBTs and MOSFETSs), can also be used in laboratory flat plate rapid cooling (Plasma, biological products, batteries), etc.
    The direct refrigerant evaporation method is used inside the plate, which greatly improves the heat transfer efficiency and improves the heat transfer power per unit area of the plate compared with the liquid cooling method.
Chiller Low temperature cascade refrigeration series
Model FLTZ-803W FLTZ-805W FLTZ-806W FLTZ-808W FLTZ-8010W
Temp Range -80°C to +90°C
Temp Control accuracy ±0.05°C (Steady State Outlet Temperature)
Flow Control 7 – 25L/min 5bar max 12 – 45L/min 6bar max
Heating capacity 2kW 2kW 2kW 3.5kW 3.5kW
Cooling capacity @-70°C 0.6kW 1kW 1.5kW 2kW 3kW
Internal circulating fluid volume 4L 5L 6L 8L 10L
Expansion tank volume 10L 10L 15L 15L 20L
Heat-conduction medium Fluorinated liquid
Connection size ZG1/2 ZG1/2 ZG3/4 ZG3/4 ZG3/4
Cooling water connection size ZG3/4 ZG3/4 ZG3/4 ZG1 ZG1
Cooling water @20°C 1.8m³/H 2.5m³/H 3m³/H 5m³/H 6m³/H
Circuit Breaker 25A 25A 32A 40A 50A
Process temperature Control The remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm
Dimension(cm) 55*70*175 65*85*185 70*85*185 70*85*185 80*120*185
Chiller Low temperature cascade refrigeration series
Model FLTZ-1002W FLTZ-1004W
Temp Range -100°C to +90°C
Temp Control accuracy ±0.05°C (Steady State Outlet Temperature)
Flow Control 7 – 25L/min 12 – 45L/min
Heating capacity 3.5kW 5.5kW
Cooling capacity @-90°C 1.5kW 3kW
Internal circulating fluid volume 5L 8L
Expansion tank volume 10L 15L
Heat-conduction medium Fluorinated liquid
Connection size ZG3/4 ZG3/4
Cooling water connection size ZG3/4 ZG1
Cooling water @20°C 50L/min 2bar-7bar 100L/min 2bar-7bar
Circuit Breaker 32A 63A
Process temperature Control The remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm
Chiller Heat Exchange System, No Compressor
Model ETCU-005W ETCU-005W ETCU-005W ETCU-005W ETCU-005W ETCU-005W ETCU-005W
Temp Range Cooling water temp. +5°C to +90°C
Temp Control accuracy ±0.05°C (Steady State Outlet Temperature)
Cooling capacity 5kW 15kW 30kW 50kW 100kW 200kW 300kW
Circulation Pump 7-20L/min 5bar 15-40L/min 5bar 20-60L/min 5bar 40-110L/min 5bar 150-250L/min 5bar 250-500L/min 5bar 400-650L/min 5bar
Tank volume 5L 10L 20L 30L 60L 120L 240L
Dimension(cm) 48*75*39 48*75*39 48*75*50 Customization Customization Customization Customization

Semiconductor Testing Chillers – FLTZ Series

Different testing requirements for in Semiconductor Industries:

  • Aging test equipment: The matching thermal drying system provides cooling and heating temperature, improves the test efficiency and quality of wafer chips, and has small temperature accuracy error.
  • Chip Testing Equipment: The thermal chiller is matched with the test machine, with a temperature control accuracy of ±0.05℃, which improves the chip testing efficiency of the institute.
  • Semiconductor Fab: The process chiller is used in semiconductor fabs, with high-precision cooling and heating temperature control, which improves the manufacturing rate of wafers and reduces the scrap rate.

Overview:

  • Working Temperature Range: -120degC to +300degC
  • FLTZ Multichannel: Has Multichannel Independent Temperature control – it can have separate temperature range, cooling and heating capacity, thermal conductivity medium flow rate, etc. According to the required temperature ranges, steam compression refrigeration or ETCU non compressor heat exchange system can be selected.
  • ZLTZ Series: Suitable for temperature control applications such as microchannel reactors, plate heat exchangers, cold plates, heat sink plates and tubular reactors with small heat exchange areas, large refrigeration capacities and small temperature differences. The equipment can automatically recycle the thermal conductive medium.
    The ZLTZ temperature control unit is combined with a microchannel reactor to form a high heat release temperature control application. Under the same flow condition, the heat transfer efficiency of the temperature control is more than 5 times that of the heat transfer oil. At the same time, the temperature difference between the inlet and outlet is small, and the temperature filed uniformity is high, which is particularly suitable for applications with intense heat release reactions. These units are in combination with cold plate and heat sink plate for high heat absorption and high uniformity temperature control.
    The ZLTZ temperature control unit is combined with ESC chucks, vacuum chucks, etc to achieve a temp control range of -65 to 200degC. At the same time, one ZLTZ TCU with multiple ESC chucks can control different temperatures.
  • LQ Series: These models use non corrosive gas as a cooling medium such as dry compressed air, nitrogen, argon and other normal temperature gas. The gas can reach the targeted low temperature, supply the demanded test components or heat exchangers.
  • AI Series: Suitable models are also used in low and high temperature testing of semiconductor equipment. Electronic equipment high temperature and low temperature thermostat testing cold and heat sources. They can work for continuously long time, automatic defrost and it will also not affect the storage temperature during defrosting. Does no affect the Evaporation process during defrosting.
  • AES Series: These Series have jet flow high and low temperature impact tester provides precise and rapid ambient temperature for chips, modules, integrated circuit boards, electronic components, etc. It is an indispensable instrument for electrical performance test, failure analysis and reliability evaluation of products.
  • AET Series: In these models the compressed air enters the gas rapid temperature change testing machine, which is equipped with a dryer. The gas is pre dried to a dew point temperature of -70degC or below and then cooled, heated and controlled to output stable flow, pressure and constant temperature gas. The temperature of the target object is controlled (various temp control chucks, chamber environments, heat support plates, material shuttles, chambers, electronic components, etc) and the temperature of the process can be controlled according to the temperature sensor on the remote chuck and then the temperature of the output gas can be automatically adjusted.
  • Rapid Temp Change temp control Chuck: This product enables rapid temp changes and precise temp control. The system itself comes with a chiller to avoid the consumption of liquid nitrogen, carbon dioxide, etc. Each system contains a chuck and a cold and heat control unit.
    The system provides an open flat surface working platform, rapid rise and fall, constant temperature control, used in RF devices and high-density power device testing (IGBTs and MOSFETSs), can also be used in laboratory flat plate rapid cooling (Plasma, biological products, batteries), etc.
    The direct refrigerant evaporation method is used inside the plate, which greatly improves the heat transfer efficiency and improves the heat transfer power per unit area of the plate compared with the liquid cooling method.
FLTZ Series
Model FLTZ-002
FLTZ-002W		 FLTZ-003
FLTZ-003W		 FLTZ-004
FLTZ-004W		 FLTZ-006
FLTZ-006W		 FLTZ-008
FLTZ-008W		 FLTZ-010
FLTZ-010W		 FLTZ-015
FLTZ-015W
Temp Range +5°C to +90°C
Temp Control accuracy ±0.05°C (Steady State Outlet Temperature)
Cooling capacity @10°C 6kW 8kW 10kW 15kW 20kW 25kW 40kW
Internal circulating fluid volume 4L 5L 6L 8L 10L 12L 20L
Expansion tank volume 10L 10L 15L 15L 20L 25L 35L
Refrigerant R410A
Refrigerating Medium Silicon Oil, fluortinated liquid, polyol aqueous solution, DI, etc (DI temp needs to be controlled above 10°C)
Connection size ZG1/2 ZG1/2 ZG3/4 ZG3/4 ZG3/4 ZG1 ZG1
Cooling water connection size ZG1/2 ZG1/2 ZG3/4 ZG1 ZG1 ZG1 ZG1 1/8
Cooling water flow @20°C 1.5m³/H 2m³/H 2.5m³/H 4m³/H 4.5m³/H 5.6m³/H 9m³/H
Process temperature Control The remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm
Dimension(cm) 95*38*106 95*38*106 95*38*106 98*43*140 98*43*140 108*60*150 108*60*150
FLTZ Series
Model FLTZ-202
FLTZ-202W		 FLTZ-203
FLTZ-203W		 FLTZ-204
FLTZ-204W		 FLTZ-206
FLTZ-206W		 FLTZ-208
FLTZ-208W		 FLTZ-210
FLTZ-210W		 FLTZ-215
FLTZ-215W
Temp Range -25°C to +90°C
Temp Control accuracy ±0.05°C (Steady State Outlet Temperature)
Flow Control 10 – 25L/min 15 – 45L/min 25 – 75L/min
Cooling capacity @ -15°C 2kW 3kW 3.8kW 6kW 7.6kW 10kW 15kW
Internal circulating fluid volume 4L 5L 6L 8L 10L 12L 20L
Expansion tank volume 10L 10L 15L 15L 20L 25L 35L
Refrigerant R448A
Refrigerating Medium Silicon Oil, fluortinated liquid, glycol solution, etc
Connection size ZG1/2 ZG1/2 ZG3/4 ZG3/4 ZG3/4 ZG1 ZG1
Cooling water connection size ZG1/2 ZG1/2 ZG3/4 ZG3/4 ZG1 ZG1 ZG1 1/8
Cooling water flow @20°C 1.2m³/H 1.6m³/H 2.6m³/H 3.6m³/H 5.5m³/H 7m³/H 10.2m³/H
Process temperature Control The remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm
Dimension(cm) 95*38*106 95*38*106 95*38*106 98*43*140 98*43*140 108*60*150 108*60*150
FLTZ Series
Model FLTZ-402
FLTZ-402W		 FLTZ-403
FLTZ-403W		 FLTZ-404
FLTZ-404W		 FLTZ-406
FLTZ-406W		 FLTZ-408
FLTZ-408W		 FLTZ-410
FLTZ-410W		 FLTZ-415
FLTZ-415W
Temp Range -45°C to +90°C
Temp Control accuracy ±0.05°C (Steady State Outlet Temperature)
Flow Control 10 – 25L/min 5bar max 15 – 45L/min 5bar max 25 – 75L/min 5bar max
Heating Using Compressor Heating, prevent condenser frosting technology
Cooling capacity @ -35°C 1kW 1.4kW 1.8kW 2.5kW 3.3kW 5kW 8kW
Internal circulating fluid volume 4L 5L 6L 8L 10L 12L 20L
Expansion tank volume 10L 10L 15L 15L 20L 25L 35L
Refrigerant R448A
Refrigerating Medium Silicon Oil, fluortinated liquid, glycol solution, etc
Connection size ZG1/2 ZG1/2 ZG3/4 ZG3/4 ZG3/4 ZG1 ZG1
Cooling water connection size ZG1/2 ZG3/4 ZG3/4 ZG1 ZG1 ZG1 ZG1 1/8
Cooling water flow @20°C 1.5m³/H 2.4m³/H 3.5m³/H 5m³/H 5.5m³/H 6m³/H 8m³/H
Process temperature Control The remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm
Dimension(cm) 95*38*106 95*38*106 95*38*106 98*43*140 98*43*140 108*50*150 108*50*150

EV Battery Testing Chiller – KRY Direct Cooling and Heating Series

The test unit needs to go through a specific temperature range curve and record the temperature change. The temperature usually ranges from -40degC to 100degC (expandable up to 150degC)

Overview:

  • Working Temperature Range: -40degC to +150degC
  • Temperature/pressure/flow can be independently controlled
  • The temperature of antifreeze ranges from -40degC to +100degC (expandable to +150degC) with a very steep temperature gradient.
  • Different application related models like – One machine for two groups control; one machine for six groups control; Variable Frequency vortex compressor.
  • Variable frequency series models: Can adopt a variable frequency vortex compressor, the operating speed is automatically adjusted according to actual needs, providing the required cooling capacity. Compared with traditional fixed frequency compressors, it significantly reduces energy consumption and improves energy efficiency performance.
  • Constant power output function for both hot and cold.
  • LNEYA PLC control with 7-inch colour large screen and comprehensive multifunctional image display of important data information.
  • Relevant operational status data can be continuously monitored and visualized on the screen. Can independently control one to multiple flow channels where each group can be independently set.
KRY Direct Cooling and Heating Series
Model KRYZ-5W-ZLH KRYZ-5-ZLH KRYZ-5W-ZL KRYZ-5-ZL
Cooling Capacity 0.5kW to 10kW 0.5kW to 10kW
Heating Capacity 0.5kW to 10kW
Undercooling Degree Refrigeration 0k-8K Heating at 0k-6k in low-temp environment, 6k-20k Refrigeration 0k-8K
Overheating Degree Refrigeration 2k-20k Heating 2k-10k Refrigeration 2k-20k
Condensation Pressure Control Accuracy Better than ±50kpa Better than ±50kpa
Suction Pressure 300kpa-650kpa ±10kpa 300kpa-650kpa ±10kpa
Battery Pack Testing Environment Temp -40°C to 50°C -40°C to 50°C
Refrigerant Flow Metering Flowmeter Flowmeter
Refrigerant R134A or R1234yf R134A or R1234yf
Cooling Method (Air Cooling) Variable frequency fan Variable frequency fan
Cooling Method (Water Cooling) 20°C 3m³/h 20°C 1.8m³/h
Compressor Brand variable frequency compressor
10 inch Touch Screen Display Real time display of various temperatures, subcooling, superheat, and cooling heat transfer capacity, pressure, flow rate, current, voltage, key parameter curve recording
Controller Programmable PLC
Communication CAN
Power Supply 380V 50HZ or 460V 60HZ 380V 50HZ or 460V 60HZ

EV Battery Testing Chiller – KRY Variable Frequency Series

The test unit needs to go through a specific temperature range curve and record the temperature change. The temperature usually ranges from -40degC to 100degC (expandable up to 150degC)

Overview:

  • Working Temperature Range: -40degC to +150degC
  • Temperature/pressure/flow can be independently controlled
  • The temperature of antifreeze ranges from -40degC to +100degC (expandable to +150degC) with a very steep temperature gradient.
  • Different application related models like – One machine for two groups control; one machine for six groups control; Variable Frequency vortex compressor.
  • Variable frequency series models: Can adopt a variable frequency vortex compressor, the operating speed is automatically adjusted according to actual needs, providing the required cooling capacity. Compared with traditional fixed frequency compressors, it significantly reduces energy consumption and improves energy efficiency performance.
  • Constant power output function for both hot and cold.
  • LNEYA PLC control with 7-inch colour large screen and comprehensive multifunctional image display of important data information.
  • Relevant operational status data can be continuously monitored and visualized on the screen. Can independently control one to multiple flow channels where each group can be independently set.
KRY Variable Frequency Series
Model KRYZ-475/KRYZ-475W KRYZ-4A15W KRYZ-4A25W
Temp Range -40°C to +100°C
Temp Control Accuracy ±0.1°C ±0.1°C ±0.1°C
Temp Feedback Pt100 Pt100 Pt100
Temp Display 0.01k 0.01k 0.01k
Flow Rate Output 1 – 25 L/min 1 – 25 L/min 1 – 25 L/min
Traffic Description When the temperature is below -30°C, the flow control is within 80% of the maximum value
Flow Rate Accuracy ±0.1 L/min ±0.1 L/min ±0.1 L/min
Pressure Display The unit can control the flow individually or separately. Need to control different solutions at the same time (customized)
Heating Power 7.5kW 15kW 25kW
Cooling Capacity (100°C) 7.5kW 15kW 25kW
Cooling Capacity (20°C) 7.5kW 15kW 25kW
Cooling Capacity (0°C) 7.5kW 15kW 25kW
Cooling Capacity (-20°C) 4.5kW 10kW 16kW
Cooling Capacity (-35°C) 1.8kW 4kW 6.5kW
Compressor Emerson Copeland
Throttle Type Electronic expansion valve
Oil Separator Emerson
Dry Filter Danfoss
Evaporator Plate heat exchanger
Circulation Pump Magnetic driven pump
Input Display 7-inch color touch screen PLC controller
Program Editor 5 programs, each program can edit 40 steps
Communication Modbus RTU protocol RS485 interface, optional CAN communication bus, Ethernet interface TCP/IP protocol
Safety Protection With self-diagnosis function; Refrigerator overload protection; High pressure switch, overload relay, thermal protection device, high temperature protection, sensor fault protection and other safety functions
Closed Circulation System The whole system is a fully closed system, there will be no oil mist at high temperature, the system in operation will not because of high temperature pressure rise, low temperature automatically add heat conduction medium.
Refrigerant R404A/R507C
Connection Size ZG3/4 ZG3/4 ZG3/4
Water-Cooled At 20°C 2500L/H ZG3/4 4000L/H ZG1 6000L/H DN32
Condenser (W) Special attention should be paid to the use of plate heat exchangers in the water circuit equipment condenser of this series of products. Water supply from a chiller or low hardness tap water requires a water purification filter
Condenser (A) Microchannel heat exchanger
Power 380V50HZ 14kW 25kW 38kW
Dimension (cm) 55*85*175 70*100*175 80*120*185
Weight 280kg 360kg 620kg
Optional The size external circulation pipe line is DN15 or DN20, do not throttle, which will increase the circulation pump load, pipe need to be insulated, and adopt rubber and plastic insulation pipe which can afford high temp, liquid low level protection
Case Material Cold rolled steel powder coating (standard color 7035)
KRY Variable Frequency Series
Model KRYZ-475W/2T KRYZ-4A15W/2T KRYZ-4A25W/2T
Temp Range -40°C to +100°C
Temp Control Accuracy ±0.1°C ±0.1°C ±0.1°C
Temp Feedback Pt100 Pt100 Pt100
Temp Display 0.01k 0.01k 0.01k
Flow Rate Output 1 – 25 L/min 1 – 25 L/min 1 – 25 L/min
Traffic Description When the temperature is below -30°C, the flow control is within 80% of the maximum value
Flow Control Accuracy/Group ±0.1 L/min ±0.1 L/min ±0.1 L/min
Number of Fluid Output Groups 2 groups 2 groups 2 groups
Pressure Control/Group 0.2bar – 2.5bar 0.2bar – 2.5bar 0.2bar – 2.5bar
Flow Pressure Description The unit can control the flow individually or separately. Need to control different solutions at the same time (customized)
Heating Power 7.5kW*2 10kW*2 15kW*2
Cooling Capacity (100°C) 7.5kW*2 15kW*2 25kW*2
Cooling Capacity (20°C) 7.5kW*2 15kW*2 25kW*2
Cooling Capacity (0°C) 7.5kW*2 15kW*2 25kW*2
Cooling Capacity (-20°C) 4.5kW*2 8.5kW*2 14kW*2
Cooling Capacity (-35°C) 1.8kW*2 4kW*2 6.5kW*2
Compressor Emerson Copeland
Throttle Type Electronic expansion valve
Oil Separator Emerson
Dry Filter Danfoss
Evaporator Plate heat exchanger
Circulation Pump Magnetic driven pump
Input Display 7-inch color touch screen PLC controller
Program Editor 5 programs, each program can edit 40 steps
Communication Modbus RTU protocol RS485 interface, optional CAN communication bus, Ethernet interface TCP/IP protocol
Safety Protection With self-diagnosis function; Refrigerator overload protection; High pressure switch, overload relay, thermal protection device, high temperature protection, sensor fault protection and other safety functions
Closed Circulation System The whole system is a fully closed system, there will be no oil mist at high temperature, the system in operation will not because of high temperature pressure rise, low temperature automatically add heat conduction medium.
Refrigerant R404A/R507C/R125/N40 All four refrigerants are available
Connection Size ZG3/4 ZG3/4 ZG3/4
Water-Cooled At 20°C 4000L/H ZG1 8000L/H DN32 12000L/H DN40
Condenser (W) Special attention should be paid to the use of plate heat exchangers in the water circuit equipment condenser of this series of products. Water supply from a chiller or low hardness tap water requires a water purification filter
Condenser (A) Microchannel heat exchanger
Power 380V50HZ 28kW 45kW 70kW
Dimension (cm) 80*120*185 100*150*185 200*145*205
Weight 660kg 850kg 1350kg
Standard Automatic antifreeze system, automatic liquid recovery system
Optional 220V 60HZ three-phase, 460V 60HZ three-phase temperature, extended to -40°C to +135°C
Optional The size external circulation pipe line is DN15 or DN20, do not throttle, which will increase the circulation pump load, pipe need to be insulated, and adopt rubber and plastic insulation pipe which can afford high temp, liquid low level protection
Case Material Cold rolled steel powder coating (standard color 7035)

EV Battery Testing Chiller – 0°C to +100°C

The test unit needs to go through a specific temperature range curve and record the temperature change. The temperature usually ranges from -40degC to 100degC (expandable up to 150degC)

Overview:

  • Working Temperature Range: -40degC to +150degC
  • Temperature/pressure/flow can be independently controlled
  • The temperature of antifreeze ranges from -40degC to +100degC (expandable to +150degC) with a very steep temperature gradient.
  • Different application related models like – One machine for two groups control; one machine for six groups control; Variable Frequency vortex compressor.
  • Variable frequency series models: Can adopt a variable frequency vortex compressor, the operating speed is automatically adjusted according to actual needs, providing the required cooling capacity. Compared with traditional fixed frequency compressors, it significantly reduces energy consumption and improves energy efficiency performance.
  • Constant power output function for both hot and cold.
  • LNEYA PLC control with 7-inch colour large screen and comprehensive multifunctional image display of important data information.
  • Relevant operational status data can be continuously monitored and visualized on the screen. Can independently control one to multiple flow channels where each group can be independently set.
One machine for six groups control 0°C to +100°C
(Temperature six groups are consistent, pressure/flow rate is independently controlled)
Model KRY-A25W/6S KRY-A38W/6S KRY-A60W/6S
Temp Range 0°C to +100°C
Temp Control Accuracy ±0.3°C ±0.3°C ±0.3°C
Temp Feedback Pt100 Pt100 Pt100
Temp Display 0.01k 0.01k 0.01k
Flow Control/Group 2 – 25 L/min 2 – 25 L/min 2 – 25 L/min
Flow Control Accuracy/Group ±0.2L/min ±0.2L/min ±0.2L/min
Number of Fluid Output Groups 6 groups 6 groups 6 groups
Pressure Control/Group 0.2bar – 2.5bar 0.2bar – 2.5bar 0.2bar – 2.5bar
Flow Pressure Description The unit can control the flow individually or separately. Need to control different solutions at the same time (customized)
Heating Power 15kW 25kW 38kW
Cooling Capacity (100°C) 25kW 38kW 60kW
Cooling Capacity (20°C) 25kW 38kW 60kW
Cooling Capacity (5°C) 18kW 27kW 42kW
Compressor Emerson Copeland
Throttle Type Electronic expansion valve
Oil Separator Emerson/GUANYA
Dry Filter Danfoss
Evaporator Plate heat exchanger
Circulation Pump Centrifugal pump, optional magnetic drive pump
Flow Pressure The pump speed is regulated by frequency converter
Input Display 7-inch color touch screen PLC controller
Communication Modbus RTU protocol RS485 interface, optional CAN communication bus, Ethernet interface TCP/IP protocol
Safety Protection With self-diagnosis function; Refrigerator overload protection; High pressure switch, overload relay, thermal protection device, high temperature protection, sensor fault protection and other safety functions
Closed Circulation System The whole system is a fully closed system, there will be no oil mist at high temperature, the system in operation will not because of high temperature pressure rise, low temperature automatically add heat conduction medium.
Refrigerant R404A/R507C/R125/N40 All four refrigerants are available
Flow Sensor Brand flow sensor
Connection Size ZG3/4 ZG3/4 ZG3/4
Water-Cooled At 20°C 6000L/H DN32 9000L/H DN40 15000L/H DN50
Condenser (W) Shenshi tube type heat exchanger
Condenser (A) Optional air-cooled equipment, upward wind, the equipment size will increase
Power 380V50HZ 38kW max 55kW max 82kW max
Dimension (cm) 200*145*205 200*145*205 200*145*205
Weight 900kg 1200kg 1950kg
Optional The size external circulation pipe line is DN15 or DN20, do not throttle, which will increase the circulation pump load, pipe need to be insulated, and adopt rubber and plastic insulation pipe which can afford high temp, liquid low level protection
Optional When the temp. is lower than the normal temp., the refrigeration system uses the cooling PID to adjust the cooling capacity, and does not adopt the heating countermeasure mode to achieve energy saving purposes.
Case Material Cold rolled steel powder coating (standard color 7035)